Most military tech in the West uses either what we would today consider basically obsolete technology predating the 2000s, not any better and often worse than we see here, or they use common off the shelf (COTS) i.e. commercial chips with commercial FPGAs for custom designs. If it was a Cold War era design the chips will definitively be worse than this.kvs wrote:"Ancient" circuit board manufactured in 2023 for a Russian MLRS guided missile. The wankers in the comments show their ignorance.
2) Obviously no precious western washing machine chips anywhere. But high grade military components that resist EW attacks. The
three main ICs are factory set gate array chips that are cheaper and more reliable than FPGAs.
3) Russia obviously has the manufacturing capacity to produce the parts needed for its military equipment. No need to run to China
The large chips on this board (1537HM2) are made at Angstrem. That is their logo. Like you said they are gate array chips. These ones have 17,600 gates. They have similar gate array chips with up to 100,000 gates. This is basically an ULA as seen on the ZX Spectrum computer except this is much larger and modern. They replace a ton of discretes. The lower layers of the chip are fixed designs, always the same for any chip, they have a bunch of gates. The upper layers basically determine how those gates are connected together and this is custom to each chip design. You design the circuit with a VHDL software tool like you would an FPGA, generate a file with their converter tools, then send this file to the factory where they basically "program" the chip by etching the last layers. This unlike an FPGA is fixed in place and can't be reprogrammed. FPGAs use memory cells for the programmable bits instead.
These huge ceramic IC packages did not exist back in the Soviet Union. They only had smaller ones. The company which makes them pretty much kept this expertise alive and made improvements since then. They are quite competitive and offer their services to the world market. The IC plastic package companies from the Soviet Union basically died because they weren't competitive against Asian companies like the ones in Malaysia. Russian chips in plastic packages are typically sent to be packaged abroad.
As for the fab which etches the actual chips on silicon wafers. Angstrem has a huge facility in Zelenograd near Moscow. They can make 150mm wafers at 600nm. More than enough for something like this. 600nm is basically the technology level used to make the Intel Pentium chips. Once again this technology level wasn't available in the Soviet Union either.
These large chips are basically representative of early 2000s Russian IC technology. Which wasn't available in Soviet times. When the Soviet Union collapsed the densest chips they could make were at the technology level of an 8086.
Russia can make denser programmable chips than this. They make their own FPGAs. The Russians have a waste capacity to make 180nm chips at Mikron. Also at Zelenograd near Moscow. Which is a process three generations newer than this. So it is 8x denser. This is basically the technology level used to make the Intel Pentium III chips. This is representative of early 2010s Russian IC technology.
Unfortunately things kind of stagnated since then. Mikron licensed a 90nm process from STMicroelectronics in France and made a small 200mm production line that can make chips with this process. Angstrem bought the AMD Fab in Dresden which used to make the Athlon 64, which were 90nm chips, and a new building was made and the tools were moved in. But this took like a decade to do. Partly thanks to the financial crisis and the bank freezing then funding for the project midway. This is the Angstrem-T fab. Owned today by NM-Tech. It has huge capacity and probably is only partially operating. According to the terms of the license the technology can't be used to make military chips though.
Like I said before in this forum the Russians are building what seems to be a pilot 300mm wafers at 28nm fab in Zelenograd between the Angstrem and Angstrem-T fabs. The building should have been topped off a couple months ago. I am sure they will find some way to get the tools for it. This should allow them to make 28nm versions of the Elbrus2K and NeuroMatrix which will be more than competitive against the yet to be deployed Block 4 electronics in the F-35.